Portable Gadgets - Mobile Gadget News

Intel and Apple just announced the new 10Gbps Thunderbolt interface this week and one of the leading makers of storage devices, LaCie immediately followed the announcement by announcing its new LaCie Little Big Disk, which the company claims as its first portable drive equipped with the breakthrough Intel-developed Thunderbolt technology. The announced device will come with two 250GB Intel 510 series SSDs in order to complement the high-speed data transfer rate Thunderbolt offers, the SSDs will be preconfigured as a Striped RAID Set for enhanced performance.

The LaCie Little Big Disk will be available by summer 2011 from the LaCie Online Store (www.lacie.com), the Apple Store (www.apple.com) and authorized resellers.

Source: Press release for LaCie Little Big Disk

Zinc Matrix Power unveiled its new zinc-silver battery pack technology at the Intel Developers Forum back in September this year, at which they also won an Intel’s Technology Innovation Accelerated award. The company promises that its new silver-zinc batteries will be available to hardware manufacturers for evalutaion and testing in early 2007, and available for productions soon afterwards.

While most battery researchers are developing DMFCs (Direct Methanol Fuel Cells) to provide more convenient and efficient battery for mobile gadgets, NEC yesterday unveiled their new super thin prototype battery that measures only 0.3mm thick. The new plastical battery is built by organic materials and it is bendable like a normal plastic piece. According to NEC, it’ll only take you 30 seconds for a brief charge to make it usable for future gadgets.

Other than WIMAX standard, CDMA2000 and WCDMA standards are aiming for high speed wireless connections as well. The CDMA Development Group has brought exciting news about the high speed (73Mbps download rate) CDMA2000 EV-DO Revision B standard, which will be available in 2008.

Samsung Electronics Co. Ltd. yesterday announced that it has developed the world’s highest density NAND flash, a 16Gigabit (that’s 2GB) NAND memory device using 50nm technology. NAND is the most widely used memory for multi-feature mobile applications.

Samsung Electronics Co. Ltd. (Korea) today announced that it has developed a 7.2 Megapixels CMOS image sensor (CIS). It is the world’s first 7.2 Megapixels CIS for compact cameras with the smallest pixel size.